Board
Type |
Single-Sided |
Double-Sided |
3
Layers / 4 Layers |
Max
Size |
230x440mm |
230x440mm |
TBD |
Base
Film Material |
PET-3mil,
PI-0.5mil/1mil/2mil |
PI-0.5mil/1mil/2mil |
PI-0.5mil/1mil/2mil |
Cu
Thickness |
0.3oz/0.5oz/1oz |
0.3oz/0.5oz/1oz |
0.3oz/0.5oz/1oz |
Coverlay |
PET-1mil,
PI-0.5mil/1mil/2mil |
PI-0.5mil/1mil/2mil |
PI-0.5mil/1mil/2mil |
Solder
mask |
LPI |
LPI |
LPI |
Min
Line width |
4mil
(partial 3mil) |
4mil
(partial 3mil) |
5mil
(partial 4mil) |
Min
Line Interval |
4mil
(partial 3mil) |
4mil
(partial 3mil) |
5mil
(partial 4mil) |
Min
Hole Diameter |
8mil(Finished) |
8mil(Finished) |
10mil(Finished) |
Min
Pad Size |
20mil |
20mil |
TBD |
Min
SMD Pitch |
20mil |
20mil |
20mil |
Surface
treatment |
Plated/Immersion
Tin, Electro/Electroless(immersion)gold
plating,ENTEK (OSP) |
Stiffener
Type |
PET,
PI, FR4 |
Adhesive |
3M
467-MP, 3M 9460 |