Rigid-Flexible PCB

  • Up to 6 layers

  • Various structure designs

  • Connector assembly

  • Dome & membrane key pad assembly

  • RoHS conform

  • Competitive price

Rigid-Flex Printed Circuit Board Manufacturing Capability

Board Type 2L / 3L / 4L / 5L / 6L
Max Size 230x300mm
Base Film Material PI-0.5mil/1mil/2mil, FR4 from 0.2mm
Cu Thickness 0.3oz/0.5oz/1oz
Coverlay PI-0.5mil/1mil/2mil
Solder mask Liquid Photo Imageable
Min Line width 4mil (partial 3mil)
Min Line Interval 4mil (partial 3mil)
Min Hole Diameter 8mil(Finished)
Min Pad Size 28mil
Min SMD Pitch 20mil
Surface treatment Plated/Immersion Tin, Electro/Electroless(immersion)gold plating,ENTEK (OSP)
Stiffener Type PI, FR4
Adhesive 3M 467-MP, 3M 9460

*The above specification is subject to be changed from time to time without further notice.

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